THERMOELECTRIC ELEMENT MODULE, PACKAGE FOR ACCOMMODATING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To solve the problem of degradation in performance of a thermoelectric element module and a semiconductor module using the same because of cracks generated in solder due to thermal stress concentration thereon in between the thermoelectric element of the thermoelectric element module and a metal member.;SOLUTION: In this thermoelectric element module 10, both ends of several thermoelectric elements 1 are bonded to the surfaces of insulator substrates 2 with metal members 4 in between, and a semiconductor device is mounted on one of the substrates 2. The elements 1 are bonded to the members 4 by soldering or with an adhesive and abut against the metal members 4 at protrusions 1a formed on its end faces. In between the peripheries of the protrusions 1a and the surfaces of the members 4 positioned opposite to them, wells are formed, large enough to accommodate a sufficient quantity of solder 3. Now that the bonding of the elements 1 to the members 4 is 3-dimensional and therefore extremely strong, the module 10 is capable of performing a long- term operation, normal and stable.;COPYRIGHT: (C)2003,JPO