WAFER ALIGNER APPARATUS, AND WAFER INSPECTION APPARATUS EQUIPPED WITH THE WAFER ALIGNER APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a wafer aligner apparatus and a wafer inspection apparatus equipped with the wafer aligner apparatus, capable of accurate detection for a cut-out portion in a wafer and for a center position of the wafer.;SOLUTION: In a wafer aligner apparatus for detecting cut-out portion in a wafer, there are provided holding means for holding a wafer, a photographing means for partly enlarging an outer peripheral end of a wafer held on the holding means for photographing thereof, a detection means including a light guide optical system for guiding wafer outer peripheral end images of one position having a cut-out portion, and images of at least other two positions on the surface of an imaging device possessed by the imaging means, and arithmetic operation means for processing images photographed by the imaging means to obtain the center position information of a wafer and the position information of the cut-out portion.;COPYRIGHT: (C)2003,JPO