SUBSTRATE DETECTING APPARATUS, SUBSTRATE ALIGNING APPARATUS, SUBSTRATE BONDING APPARATUS HAVING THESE, WAFER OUTER SHAPE DETECTING APPARATUS, WAFER ALIGNING APPARATUS, AND WAFER BONDING APPARATUS HAVING WAFER OUTER SHAPE DETECTING APPARATUS AND WAFER ALIGNING APPARATUS

摘要

PROBLEM TO BE SOLVED: To correctly detect a wafer outer shape corresponding to bonded faces in a multilayer wafer in which a plurality of wafers are laminated.;SOLUTION: A wafer outer shape detecting apparatus comprises: a rotating apparatus 12 for rotating a wafer 11; an edge detecting apparatus 15 for detecting the edge of the wafer placed on the rotating apparatus; a servo apparatus 16 for making the edge detecting apparatus follow displacement of the wafer edge; and a position detecting apparatus 17 for detecting the position of the edge detecting apparatus in the radius direction of the wafer.;COPYRIGHT: (C)2014,JPO&INPIT