首页>
外国专利>
Controlled magnetron shape for uniformly sputtered thin film
Controlled magnetron shape for uniformly sputtered thin film
展开▼
机译:受控的磁控管形状,可均匀溅射薄膜
展开▼
页面导航
摘要
著录项
相似文献
摘要
A sputtering chamber includes a sputtering target with a front target surface, and a magnetron behind the sputtering target. The magnetron provides a magnetic field at the front target surface along a generally round path that includes a path indentation. A shutter is spaced apart from the front target surface by a shutter spacing. A substrate is aligned with a central region in front of the front target surface and spaced apart from the front target surface by a selected spacing that is greater than the shutter spacing. The central region has a diameter defined by a uniformly sputtered thickness of deposited layers on the substrate. The path indentation is set to a path indentation depth that adjusts the selected spacing to maximize the diameter.
展开▼