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Method for controlling thin film compositions of a composite by changing magnetic field's positions formed on a target surface in a magnetron sputtering machine
Method for controlling thin film compositions of a composite by changing magnetic field's positions formed on a target surface in a magnetron sputtering machine
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机译:通过改变在磁控溅射机中形成在目标表面上的磁场的位置来控制复合材料的薄膜组成的方法
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摘要
PURPOSE: A magnetron sputtering method is provided which forms a thin film material having various constituents or compositions and substantially extends the life cycle of a target. CONSTITUTION: The method for obtaining various compositions of a thin film material by changing positions of magnetic field formed on the surface of a target in a magnetron sputter comprises the steps of arranging two or more materials for forming a thin film on the same target of the magnetron sputter; and controlling compositions of a thin film material to be finally obtained by changing positions of magnetic field formed on the target, wherein the method for changing the positions of the magnetic field formed on the target comprises the steps of arranging a target on which a thin film material to be formed is put inside a vacuum chamber; forming magnetic field lines by magnetic field on the upper part of the target by impressing a first DC current to a first magnetic field generation means which is formed at the lower part of the target in such a form that a coil is coiled on an iron core; and additionally forming magnetic field lines by magnetic field on the upper part of the target by impressing a second DC current to a second magnetic field generation means which is formed at the lower part of the target in such a form that a coil having a diameter larger than the coil of the first magnetic field generation means is coiled on an iron core having a diameter larger than the coil of the first magnetic field generation means.
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