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Package for reducing cross-talk between devices on a device substrate and a method of manufacture therefor
Package for reducing cross-talk between devices on a device substrate and a method of manufacture therefor
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机译:用于减少器件基板上的器件之间的串扰的封装及其制造方法
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摘要
The present invention provides, in one aspect, a package for reducing cross-talk between devices on a device substrate, an integrated device including the package, and a method of manufacture therefor. In one embodiment of the invention, the package includes a cap positioned over a first device. In such an embodiment, the cap is configured to separate the first device and a second device and to substantially reduce cross-talk there between. The package may further include a layer of barrier material located on a surface of the cap.
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