PACKAGE FOR REDUCING CROSSTALK BETWEEN DEVICES ON DEVICE SUBSTRATE, AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a package for reducing crosstalk between devices on a device substrate, an integrated device including the package, and to provide a method for manufacturing the package. ;SOLUTION: The package for reducing crosstalk between the devices on the device substrate, the integrated device including the package, and the method for manufacturing the package and provided in one configuration. In one embodiment, the package includes a cap positioned above a first device. In such an embodiment, the cap is constituted so as to isolate a first and a second devices from each other and reduce crosstalk essentially between the devices. The package can also include a layer composed of barrier material which is positioned on a surface of the cap.;COPYRIGHT: (C)2003,JPO