NO-CLEAN, LOW-RESIDUE, VOLATILE ORGANIC COMPOUND FREE SOLDERING FLUX AND METHOD OF USE

摘要

No-clean soldering fluxes and methods of using same are described. The fluxes contain from about 1 % to about 4 % by weightof fluxing agents. At least two fluxing agents selected from monocarboxylic, dicarboxylic and/or hydroxy acids are present. Nonionicsurfactant is incorporated in the fluxes in an amount less than about 1 % by weight. The solvent system can be demineralized water withoutany other cosolvents or a cosolvent system comprised of (i) at least about 90 % by weight demineralized water based on total weight of thesoldering flux solution and (ii) from about 1 % by weight to about 5 % by weight based on total weight of the soldering flux solution ofa non-volatile organic solvent forming a cosolvent with said demineralized water, said nonvolatile organic solvent having a boiling pointabove about 190 °C and a vapor pressure below 0.1 millimeters Hg at 25 °C.