Soldering Solvent with Low Residue and No Volatile Organic Compound (NO-CLEAN, LOW-RESIDUE, VOLATILE ORGANIC COMPOUND FREE SOLDERING FLUX AND METHOD OF USE)

摘要

Soldering flux and a method of manufacturing the same are disclosed. This melt contains 1-4% by weight of flux, and there are at least two monocarboxylic acids, dicarboxylic acids and / or oxyacids. Less than 1% by weight of surfactant is present in the flux. The solvent system comprises a co-solvent composed of (i) at least 90% by weight of demineralized water with respect to the braze melt, and (ii) a nonvolatile organic solvent having a boiling point of at least about 190 ° C and a vapor pressure of at most 0.1 mmHg at 25 ° C. It is made of demineralized water without a cosolvent system or other cosolvent system composed of 1 to 5% by weight relative to the nonvolatile organic solvent.