首页> 外国专利> Strip conductor arrangement used in integrated circuits comprises first insulating layer, second insulating layer, third insulating layer, strip conductors, electrical contact electrically coupling strip conductors in first and third layers

Strip conductor arrangement used in integrated circuits comprises first insulating layer, second insulating layer, third insulating layer, strip conductors, electrical contact electrically coupling strip conductors in first and third layers

机译:集成电路中使用的带状导体装置包括第一绝缘层,第二绝缘层,第三绝缘层,带状导体,在第一和第三层中电接触使带状导体电耦合

摘要

A strip conductor arrangement comprises a first layer (101) made from a first insulating material; a second layer (106) made from a second insulating material arranged on the first layer; a third layer (108) made from a third insulating material arranged on the second layer; a strip conductor integrated in the first layer and a strip conductor integrated in the third layer; and an electrical contact (104) electrically coupling the strip conductor in the first layer with the strip conductor in the third layer. The strip conductors and the electrical contact are made from an electrically conducting material and are surrounded by an encapsulating layer (103) made from a capsule material which is mechanically harder than the electrically conducting material. An Independent claim is also included for the production of an encapsulated strip conductor coupling. Preferred Features: The first, second and third insulating materials are mechanically softer than the electrically conducting material and are made from an organic material. The capsule material is a nitrogen compound, preferably silicon nitride, titanium nitride and/or tantalum nitride.
机译:带状导体装置包括由第一绝缘材料制成的第一层(101);第二层(101)。由第二绝缘材料制成的第二层(106)布置在第一层上;由第三绝缘材料制成的第三层(108)布置在第二层上;集成在第一层中的带状导体和集成在第三层中的带状导体;电触点(104)将第一层中的带状导体与第三层中的带状导体电耦合。条形导体和电触点由导电材料制成,并且被由胶囊材料制成的封装层(103)围绕,该胶囊材料在机械上比导电材料硬。还包括独立权利要求,用于生产密封的条形导体耦合。优选特征:第一,第二和第三绝缘材料在机械上比导电材料软,并且由有机材料制成。胶囊材料是氮化合物,优选氮化硅,氮化钛和/或氮化钽。

著录项

  • 公开/公告号DE10127934A1

    专利类型

  • 公开/公告日2002-12-19

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE2001127934

  • 发明设计人 SCHINDLER GUENTHER;ENGELHARDT MANFRED;

    申请日2001-06-08

  • 分类号H01L23/522;H01L21/768;

  • 国家 DE

  • 入库时间 2022-08-21 23:43:01

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