SOLDER JOINING MATERIAL AND POWER MODULE SUBSTRATE UTILIZING THE SAME

摘要

PROBLEM TO BE SOLVED: To increase a thermal cycle lifetime of a solder joining material and improve a thermal conductivity.;SOLUTION: A solder joining material 11 comprises a foaming metallic material and a solder material. The foaming metallic material is formed in three-dimensional net like porous quality with a metallic material having a higher melting point than the solder material and having solder wettability. The solder material is impregnated into the foaming metallic material and coats the surface of a foaming metallic material. The foaming metallic material is composed of Cu, Ni, Ag or Fe. An average diameter of pores of foaming metallic material is 10-1,000 μm. A porosity of the foaming metallic material is 20-95 %.;COPYRIGHT: (C)2005,JPO&NCIPI