PACKAGE LID FOR HIGH-FREQUENCY CIRCUIT, ITS MANUFACTURING METHOD, AND PACKAGE FOR HIGH FREQUENCY CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a package lid for a high-frequency circuit provided with a resonance suppression function, and to provide the package for the high-frequency circuit using it.;SOLUTION: In the package lid for the high-frequency circuit, a lid at least of which the surface is composed of Au and an electromagnetic absorption body are secured via at least one kind of a securing member selected from among a low-melting point metal, low-melting point glass, an inorganic adhesive and synthetic resin, and with the oxygen concentration of the surface of the lid set at 10 atom%.;COPYRIGHT: (C)2004,JPO