GRINDING COMPOSITION AND SILICON WAFER GRINDING METHOD EMPLOYING THE SAME, AS WELL AS RINSING COMPOSITION AND SILICON WAFER RINSING METHOD EMPLOYING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a grinding composition and a silicon wafer grinding method employing the same which improves a haze level much more, as well as a rinsing composition and a silicon wafer rinsing method employing the same.;SOLUTION: The grinding compound contains (a) hydroxyethyl cellulose, (b) 0.005-0.5 wt% of polyethylene oxide, (c) alkaline compound, (d) water and (e) silicon dioxide. In this case, the grinding composition is constituted so as to be used in a grinding process for the purpose of improving the haze level of surface of the silicon wafer when the grinding is applied on the surface of the silicon wafer by dividing it into a plurality of stages. The rinsing composition contains respective constituents of (a), (b), (c) and (d), and is constituted so as to be used for rinse applied on the surface of the silicon wafer after the grinding process.;COPYRIGHT: (C)2004,JPO