The grinding composition for the silicon wafer, being grinding method of the silicon wafer and the grinding composition for the silicon wafer

摘要

A polishing composition used for polishing of silicon wafers, the invention provides a polishing composition and are environmentally friendly, improved smoothness. Silicon wafer polishing composition of the present invention is characterized in that water is a metal oxide, and alkaline substances, alkaline substances are guanidines. The silicon wafer polishing composition of the present invention is characterized in that consists of water and an alkaline substance, an alkaline substance is a guanidine. Polishing These compositions may also contain a chelating agent. It is a silicon oxide or cerium oxide is preferable that the metal oxide. Polishing method using the polishing composition, and the present invention includes a kit of the polishing composition.