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Dicing tape attaching unit that can attach pre-cut dicing tape and general dicing tape to wafer and in-line system having the dicing tape attaching unit
Dicing tape attaching unit that can attach pre-cut dicing tape and general dicing tape to wafer and in-line system having the dicing tape attaching unit
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机译:可以将预切割的切割带和普通切割带附着到晶片的切割带附着单元以及具有该切割带附着单元的在线系统
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摘要
A dicing tape attaching unit that can attach both a pre-cut dicing tape and a general dicing tape to a wafer in a semiconductor package assembling process, and an in-line system used in a semiconductor package process including the dicing tape attaching unit are provided. The dicing tape attaching unit supplies one of the pre-cut dicing tape and the general dicing tape and attaches it to a wafer according to the direction of rotation of a tape loader. Accordingly, without an additional pre-cut dicing tape attaching unit, either of the pre-cut dicing tape and the general dicing tape can be attached to the back side of the wafer by one and the same unit.
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