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Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board

机译：树脂板，树脂板的制造工艺，连接介质体，电路板以及电路板的制造工艺

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摘要

A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.

机译：在至少一个板表面上提供压缩功能层 60 。压缩功能层 60 通过向板厚方向的树脂板 10 施加沿板厚方向的压力而被压缩的功能。因此，足够的压力施加到导体 14上。 展开▼

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公开/公告号US2004005443A1

专利类型

公开/公告日2004-01-08

原文格式PDF

申请/专利权人 MATSUSHITA ELECTRIC INDUSTRIAL CO. LTD.;
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申请/专利号US20030607306

发明设计人 FUMIO ECHIGO;YOSHIHIRO KAWAKITA;YASUSHI NAKAGIRI;TAKESHI SUZUKI;SATORU TOMEKAWA;
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申请日2003-06-27

分类号B32B3/00;

国家 US

入库时间 2022-08-21 23:14:36

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