首页>
外国专利>
FLIP CHIP DIE BOND PADS, DIE BOND PAD PLACEMENT AND ROUTING OPTIMIZATION
FLIP CHIP DIE BOND PADS, DIE BOND PAD PLACEMENT AND ROUTING OPTIMIZATION
展开▼
机译:倒装芯片键合垫,芯片键合垫的位置和布线优化
展开▼
页面导航
摘要
著录项
相似文献
摘要
An integrated circuit die for a flip chip has circular die bond pads (122). Circular die bond pads allows for a higher density of bond pads when a mating printed circuit board has routing lines between its corresponding pads. In one form, there is provided a flip chip having a die (120) and a plurality of die bond pads (122) situated on the die. Each die bond pad of the die is circular.
展开▼