A process for electroplating nickel and copper deposits on zirconium or zirconium alloy substrates

摘要

PURPOSE: A plating process for enabling high coherence plating to be carried out on zirconium and zirconium alloy is provided. CONSTITUTION: The plating process of zirconium and zirconium alloy base metal comprises a step of pretreating zirconium and zirconium alloy base metal; a nickel plating step; a copper strike plating step; a copper sulfate plating step; and a nickel plating step, wherein the pretreating step comprises the process of performing electrolytic etching using Wood's nickel strike bath containing 100 to 300 g/L of nickel chloride hexahydrate and 50 to 200 g/L of hydrochloric acid as the anode, and positive plate and negative plate formed of stainless steel, platinum mesh and carbon pressed plate at electric current of 0.5 to 10 volts for 0.3 to 4 minutes, wherein the pretreatment step comprises a step of removing smut using nitric acid, hydrogen peroxide and polyethylene glycol as a smut remover at an ordinary temperature for 0.1 to 3 minutes, wherein Wood's nickel strike bath as a high coherence strike plating bath is used on the zirconium and zirconium alloy base metal, wherein the nickel plating step after the nickel strike plating step comprises electrolytic nickel plating process using Watt's bath performed to a low current density of 0.1 to 0.5 ASD for 10 to 60 minutes, wherein the copper strike plating step is performed by performing copper strike plating on a nickel plating layer using copper cyanide, wherein a copper plating layer having a thickness of 4 to 10 micrometers is formed using a copper sulfate solution in the copper sulfate plating step, and wherein a nickel plating layer having a thickness of 5 to 10 micrometers is formed on a copper sulfate plating layer using electrolytic nickel plating solution and electroless nickel plating solution in the nickel plating step after the copper sulfate plating step.