首页> 外国专利> CHAMBER FOR HEATING UNIFORMLY SUBSTRATE WITHOUT CONTAMINATION AT LOW COST

CHAMBER FOR HEATING UNIFORMLY SUBSTRATE WITHOUT CONTAMINATION AT LOW COST

机译:用于低成本均匀加热的腔室

摘要

First equipment is provided for heating substrate in the form of first. First device includes the Room (1) one with a lower end and a upper end; (2) bracket for being used to support at least two substrates of multiple heating is arranged in upper chamber; (3) being configured between the side wall of room and multiple substrate supports in room and a heater with a fringe region and a central area and. Heater generates more heat than the central area edge region of heater. It is provided with a different shape.
机译:提供第一设备以第一形式加热衬底。第一个设备包括房间(1),房间的下端和上端; (2)在上部腔室中设置有用于支撑至少两个多重加热基板的支架。 (3)配置在房间的侧壁和房间内的多个基板支撑件之间,以及具有边缘区域和中央区域的加热器。加热器产生的热量大于加热器中心区域的边缘区域。它具有不同的形状。

著录项

  • 公开/公告号KR20040054514A

    专利类型

  • 公开/公告日2004-06-25

    原文格式PDF

  • 申请/专利权人 APPLIED MATERIALS INC.;

    申请/专利号KR20030091832

  • 发明设计人 HOSOKAWA AKIHIRO;INAGAWA MAKOTO;

    申请日2003-12-16

  • 分类号H01L21/20;

  • 国家 KR

  • 入库时间 2022-08-21 22:48:45

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