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Integrated circuit arrangement, has electronic components in semiconductor substrate each provided with contact pad for functional testing

机译:集成电路装置,在半导体衬底中具有电子部件,每个电子部件都配有用于功能测试的接触垫

摘要

An integrated semiconductor circuit has a number of electronic components in a semiconductor substrate (3) and at least two components (1,2) in the substrate (3) are electrically isolated and each has at least one contact pad (4;5) on the substrate surface (7) for carrying out functional testing. An independent claim is included for a method of manufacturing an integrated semiconductor circuit.
机译:集成半导体电路在半导体衬底(3)中具有多个电子组件,并且衬底(3)中的至少两个组件(1,2)被电隔离,并且每个组件上均具有至少一个接触垫(4; 5)进行功能测试的基材表面(7)。包括对制造集成电路的方法的独立权利要求。

著录项

  • 公开/公告号DE10247528A1

    专利类型

  • 公开/公告日2004-01-08

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE2002147528

  • 发明设计人 LOSEHAND REINHARD;GABL REINHARD;

    申请日2002-10-11

  • 分类号H01L21/66;

  • 国家 DE

  • 入库时间 2022-08-21 22:43:51

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