APPARATUS FOR FILLING UP THROUGH HOLE OF PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD USING SAME

摘要

PROBLEM TO BE SOLVED: To provide a reliable apparatus for filling up through holes of a printed wiring board which never causes defects in a printed wiring board by a temperature load, a thermal shock load, etc.;SOLUTION: The apparatus for filling up through-holes of a printed wiring board comprises a transfer means (8) for transferring a substrate (1) in a predetermined transfer direction (D), a roller (5) for applying a filler onto the surface (1b) of the substrate (1), a first squeegee (7A) which is in slide contact with the surface (1b) of the substrate (1) being transferred at a first angle (θ1) to scratch off part of the filler (3) applied by the roller (5), and a second squeegee (7B) which is also in slide contact with the surface (1b) of the substrate (1) at a second angle (θ2) on the downstream side in the transfer direction of the first squeegee (7A) to further scratch off a remainder of the filler (3) left over behind the first squeegee (7A). The first and second angles (θ1 and θ2) are set to different values, with the first angle (θ1) being set to nearly 90°.;COPYRIGHT: (C)2006,JPO&NCIPI