METHOD OF CLEANING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING CLEANING SOLUTION, METHOD AND DEVICE OF CLEANING APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of cleaning a semiconductor device, a method and a device of cleaning an apparatus for manufacturing the semiconductor device capable of precisely removing a contaminated metal remained on the surface, rear face, and /or end face of the semiconductor device including a metal used in a damascene process, moreover the inner face of the device of manufacturing the semiconductor device, the face of the apparatus for manufacturing the semiconductor device, etc. and abrasive slurry used for CMP.;SOLUTION: A semiconductor device is brought into contact with a nonmetallic cyanic compound containing solution or a cyanic compound containing alcohol base solution to remove a heavy metal in a surface region. After that, the cleaning treatment of the semiconductor device is performed, and thereby, the contaminated metal that is attached to the semiconductor device is formed into a compound with cyanogen or a complex with the cyanic compound. Then, it is removed together with cleaning treatment liquid, and thereby the cleaning and stabilization of the same surface can be easily attained without etching the surface of the semiconductor device.;COPYRIGHT: (C)2005,JPO&NCIPI