Method of using micro-contact imprinted features for formation of electrical interconnects for substrates

摘要

An imprinting stamp to imprint an opening in a material layer in which the imprint stamp has a coating of a seed material. The seed material is transferred onto the surface within the opening to operate as a seed for filling the opening. In one embodiment, low surface energy material is used as a passivation layer between the imprinting surface and the seed coating to reduce adhesion during micro-contact transfer of the seed into the opening. The imprinting stamp is used to form trenches and via openings for formation of electrical interconnects.