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The high frequency electrical properties of interconnects on a flexible polyimide substrate including the effects of humidity

机译:柔性聚酰亚胺基板上互连的高频电特性,包括湿度的影响

摘要

Flexible circuit board materials can be used to advantage in radio frequency and high-speed digital systems but an obstacle to their use is the lack of availability of information on the electrical properties of materials to high frequencies and, in particular, the variation in dielectric constant and loss tangent as a function of frequency. This makes accurate electromagnetic simulation of high frequency flexible interconnects difficult. The variation of the electrical properties of these materials as a function of environmental parameters, such as humidity, is also unknown at higher frequencies. This paper has, using microwave resonators, investigated the electrical properties from 2 GHz to 18 GHz of a polyimide flexible circuit board material saturated at 25% RH and at 85% RH relative humidity levels. Rigid circuit board materials FR4 and CER-10 were also measured as reference materials. The relative permittivity, epsilon(r), total loss, alpha(T), and loss tangent, tan delta, have been extracted from the measurements for each material. The strong influence of conductor losses on overall losses when using thin materials such as flex at high frequency has also been evaluated and quantified in these measurements. In addition to the resonators used for measurement of material electrical properties, microstrip transmission lines were also included on each test sample and their s-parameters were measured at the same time and under the same conditions as the resonators. Comparisons between the measured electrical performance of the microstrip transmission lines and simulations of the lines based on the extracted material parameters show a high degree of correlation, indicating the validity of both the use of the resonator approach and overall loss measurement methodologies.
机译:柔性电路板材料可以在射频和高速数字系统中获得优势,但使用它们的障碍是缺乏有关材料对高频电性能的信息,尤其是介电常数的变化损耗角正切是频率的函数。这使得对高频柔性互连的精确电磁仿真变得困难。这些材料的电性能随环境参数(例如湿度)的变化在较高频率下也是未知的。本文使用微波谐振器研究了在25%RH和85%RH相对湿度水平下饱和的聚酰亚胺柔性电路板材料在2 GHz至18 GHz的电性能。还测量了刚性电路板材料FR4和CER-10作为参考材料。从每种材料的测量值中已提取出相对介电常数ε,总损耗α(T)和损耗角正切tanδ。在这些测量中,还评估并量化了使用高频弯曲等薄材料时导体损耗对整体损耗的强烈影响。除了用于测量材料电性能的谐振器之外,每个测试样本还包括微带传输线,并且在与谐振器相同的时间和相同的条件下测量它们的s参数。微带传输线的测量电性能与基于提取的材料参数的线路模拟之间的比较显示出高度的相关性,表明了使用谐振器方法和整体损耗测量方法的有效性。

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