PURPOSE: A soldering flux of a lead-free alloy is provided to prevent a welding fault by improving a dispersion property of the soldering flux in match with a melting point and fluidity of a lead-free solder. CONSTITUTION: A soldering flux of a lead-free alloy includes 0.01 to 5.0 weight percent of pyridine bromine salt, 0.01 to 5.0 weight percent of guanidine bromine salt, 0.1 to 8.0 weight percent of gum rosin, 0.01 to 5.0 weight percent of synthetic rosin, 0.01 to 5.0 weight percent of fatty acid, industrial alcohol, 0.1 to 8.0 weight percent of disproportionated rosin, 0.01 to 5.0 weight percent of maleic degenerated rosin, and 0.01 to 5.0 weight percent of ethyl amine bromine salt. An Sn-Cu-Ni-P based lead-free alloy solder is used for the soldering flux.
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