首页> 外国专利> PACKAGE RESONANCE SUPPRESSING CIRCUIT, OSCILLATOR, HIGH FREQUENCY MODULE, COMMUNICATION MACHINE APPARATUS, AND PACKAGE RESONANCE SUPPRESSING METHOD

PACKAGE RESONANCE SUPPRESSING CIRCUIT, OSCILLATOR, HIGH FREQUENCY MODULE, COMMUNICATION MACHINE APPARATUS, AND PACKAGE RESONANCE SUPPRESSING METHOD

机译:包共振抑制电路,振荡器,高频模块,通信机装置以及包共振抑制方法

摘要

PROBLEM TO BE SOLVED: To provide a package resonance suppressing circuit which is excellent in resonance suppressing property and is capable of ensuring an enough element mounting area on a substrate in a small-sized package; and also to provide an oscillator, a high frequency module, a communication machine apparatus, and a package resonance suppressing method.;SOLUTION: The oscillator 1 comprises the package 2, a high frequency circuit substrate 3, and the package resonance suppressing circuit 4. The package resonance suppressing circuit 4 is formed to constitute a closed circuit C by connecting through holes 41, 42 to a ground conductor 32 of the high frequency circuit substrate 3, and connecting patterns 43, 44 to the through holes 41, 42 in a one to one correspondence, and further connecting a resistor 46 between the patterns 43, 44. Preferably, the direction of the resistor 46 is set to be perpendicular to a magnetic field H by cavity resonance.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:提供一种封装谐振抑制电路,该封装谐振抑制电路的谐振抑制特性优异,并且能够在小尺寸封装中确保在基板上足够的元件安装面积。解决方案:振荡器1包括封装2,高频电路基板3和封装共振抑制电路4,并提供振荡器,高频模块,通信机器设备和封装共振抑制方法。通过将通孔41、42连接到高频电路基板3的接地导体32,并且将图案43、44连接到通孔41、42中的一个中,形成封装谐振抑制电路4以构成闭合​​电路C。最好,通过空腔谐振将电阻器46的方向设置为垂直于磁场H 。;版权:(C)2006,JPO&NCIPI

著录项

  • 公开/公告号JP2006041273A

    专利类型

  • 公开/公告日2006-02-09

    原文格式PDF

  • 申请/专利权人 MURATA MFG CO LTD;

    申请/专利号JP20040220607

  • 申请日2004-07-28

  • 分类号H05K9/00;H01L23/02;

  • 国家 JP

  • 入库时间 2022-08-21 21:51:06

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