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PACKAGE RESONANCE SUPPRESSING CIRCUIT, OSCILLATOR, HIGH FREQUENCY MODULE, COMMUNICATION MACHINE APPARATUS, AND PACKAGE RESONANCE SUPPRESSING METHOD
PACKAGE RESONANCE SUPPRESSING CIRCUIT, OSCILLATOR, HIGH FREQUENCY MODULE, COMMUNICATION MACHINE APPARATUS, AND PACKAGE RESONANCE SUPPRESSING METHOD
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机译:包共振抑制电路,振荡器,高频模块,通信机装置以及包共振抑制方法
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摘要
PROBLEM TO BE SOLVED: To provide a package resonance suppressing circuit which is excellent in resonance suppressing property and is capable of ensuring an enough element mounting area on a substrate in a small-sized package; and also to provide an oscillator, a high frequency module, a communication machine apparatus, and a package resonance suppressing method.;SOLUTION: The oscillator 1 comprises the package 2, a high frequency circuit substrate 3, and the package resonance suppressing circuit 4. The package resonance suppressing circuit 4 is formed to constitute a closed circuit C by connecting through holes 41, 42 to a ground conductor 32 of the high frequency circuit substrate 3, and connecting patterns 43, 44 to the through holes 41, 42 in a one to one correspondence, and further connecting a resistor 46 between the patterns 43, 44. Preferably, the direction of the resistor 46 is set to be perpendicular to a magnetic field H by cavity resonance.;COPYRIGHT: (C)2006,JPO&NCIPI
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