Eliminating package resonances in printed circuit boards over wide frequency band.

摘要

An electronic package provides electrical interconnection, mechanical support and thermal protection for the chips in the system. High frequency signals in a package/PCB cause signal and power integrity effects, which could seriously degrade the performance of the system. This work deals with one of the aspects in power integrity and proposes a new approach to improve the power integrity of a package/PCB by eliminating resonances in the package.; The idea was to move the resonances to a frequency beyond the frequency at which current is drawn from the power planes. A "screen" metal layer is incorporated in between the power and ground plane. The effect of using a "screen" metal layer was modeled using simulation tools and measurements were made on the hardware setup with a Network Analyzer. We concluded that it is possible to eliminate resonances up-to multi-GHz frequencies using this approach.