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2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.

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1.An efficient method for transient simulation of high-speed interconnects with nonlinear terminations

机译：带有非线性终端的高速互连瞬态仿真的有效方法
- 作者：Farhan Mina;Gad Emad;Nakhla Michel;Achar Ram
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
2.I/O supply current synthesis for power integrity analysis of single-ended signaling scheme

机译：I / O电源电流合成，用于单端信令方案的电源完整性分析
- 作者：Koo Jayong;Quddus Md R.;Silva Benjamin P.;Norman Adam J.
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Power integrity;
- memory;
- single-ended signaling;
- supply noise;
3.A discussion of an analytical per-unit-length impedance matrix model

机译：解析的单位长度阻抗矩阵模型的讨论
- 作者：Broyde Frederic;Clavelier Evelyne;De Zutter Daniel;Ginste Dries Vande
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Multiconductor transmission lines;
- resistive loss model;
- signal integrity analysis;
4.An enhanced current mirror for SSO simulation

机译：用于SSO仿真的增强型电流镜
- 作者：Young Brian
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- SSI;
- SSN;
- SSO;
- Spice;
- bridge;
- current mirror;
5.Eye prediction of digital driver with power distribution network noise

机译：具有配电网络噪声的数字驱动器的眼图预测
- 作者：Chou Chiu-Chih;Chuang Hao-Hsiang;Wu Tzong-Lin;Weng Shih-Hung;Cheng Chung-Kuan
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- eye diagram;
- multiple bit pattern response;
- nonlinear effect;
- power distribution network;
- worst case estimation algorithm;
6.Power-bandwidth trade-off on TSV array in 3D IC and TSV-RDL junction design challenges

机译：TSV阵列在3D IC和TSV-RDL结设计中的功率带宽折衷
- 作者：Yao Wei;Shi Feng;He Lei;Pan Siming;Achkir Brice;Li Li
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
7.A statistical assessment of opto-electronic links

机译：光电链接的统计评估
- 作者：Manfredi Paolo;Stievano Igor S.;Perrone Guido;Bardella Paolo;Canavero Flavio G.
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Circuit modeling;
- circuit simulation;
- optical interconnects;
- stochastic analysis;
- stochastic collocation;
- tolerance analysis;
- uncertainty;
8.Electrical interconnect design for testing of high-speed IC transceivers

机译：用于高速IC收发器测试的电气互连设计
- 作者：Rimolo-Donadio R.;Baks C.;Lee B. G.;Song J. H.;Gu X.;Kwark Y. H.;Kuchta D. M.;Rylyakov A. V.;Schow C. L.
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- interconnects;
- power integrity;
- printed circuit board;
- short-reach link;
- signal integrity;
- wire bond;
9.Minimizing simultaneous switching noise at reduced power with power transmission lines for high-speed signaling

机译：利用用于高速信号传输的输电线路，以降低的功率将同时发生的开关噪声降至最低
- 作者：Telikepalli Satyanarayana;Swaminathan Madhavan;Keezer David
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- power delivery network;
- power transmission line;
- simultaneous switching noise;
10.Challenges in extending single-ended graphics memory data rates

机译：扩展单端图形内存数据速率的挑战
- 作者：Mukherjee Sanku;Oh Dan;Vaidyanath Arun;Dressler Deborah;Sendhil Arul
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- BER;
- Graphics;
- ISI;
- Memory;
- POD I/O;
- SSO;
- VREF;
- single-ended;
11.Thermal analysis and optimization of 2.5-D integrated voltage regulator

机译：2.5D集成稳压器的热分析和优化
- 作者：Song Taigon;Sturcken Noah;Athikulwongse Krit;Shepard Kenneth;Lim Sung Kyu
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Analog;
- Integrated Voltage Regulator;
- Mixed System;
- Silicon Interposer;
- Thermal Analysis;
12.Ultra-high speed memory bus using microwave interconnects

机译：使用微波互连的超高速存储总线
- 作者：Aberle James T.;Bensalem Brahim
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- DDR Memory;
- Memory Wall;
- SIW;
- Signal Integrity;
13.S-parameter based multimode signaling

机译：基于S参数的多模信令
- 作者：Yan Zhuo;Won Chanyoun;Franzon Paul D.;Aygun Kemal;Braunisch Henning
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- S-parameters;
- co-design;
- multimode signaling;
14.Ultra-low power on-chip differential interconnects using high-resolution comparator

机译：使用高分辨率比较器的超低功耗片上差分互连
- 作者：Liu Hao;Cheng Chung-Kuan
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
15.Optimization of the stub-alternated and serpentine microstrip structures to minimize far-end crosstalk

机译：优化存根交替和蛇形微带结构，以最大程度减少远端串扰
- 作者：Becerra-Perez Daniel;Rayas-Sanchez Jose E.
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Nelder-Mead;
- crosstalk reduction;
- genetic algorithm;
- microstrip;
- optimization;
- serpentine;
- stub-alternated;
16.Electrical performance of via transitions in the presence of overlapping anti-pads

机译：防焊盘重叠时通孔过渡的电气性能
- 作者：Kostka Darryl;Scogna Antonio Ciccomancini;Zhang Jianmin;Qiu Kelvin;Brooks R.
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- PCB;
- Vias;
- anti-pads;
- high speed;
- signal integrity;
17.Circuit modeling of nonlinear lossy frequency dependent thin-film magnetic inductors

机译：非线性有损频率依赖型薄膜磁感应器的电路建模
- 作者：Elsherbini Adel;Braunisch Henning;OBrien Kevin
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- equivalent circuit modeling;
- integrated voltage regulator;
- nonlinear inductor;
- thin-film magnetic inductor;
18.Comparison of TSV-based PDN-design effects using various stacking topology methods

机译：使用各种堆叠拓扑方法比较基于TSV的PDN设计效果
- 作者：Charles Gary;Franzon Paul D.
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- 3D IC;
- B2F and B2B;
- F2B;
- F2F;
- Power delivery network (PDN);
- Redistribution layer (RDL);
- SSN;
- Through silicon via (TSV);
- target impedance;
19.Crosstalk through finite ground

机译：通过有限地面的串扰
- 作者：Yang Long;Umaretiya Jagdish
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Crosstalk;
- differential;
- diffraction;
- finite ground;
- single-ended;
- transmission line theory;
20.Minimizing displacement return currents in multilayer via structures

机译：最小化多层通孔结构中的位移返回电流
- 作者：Hardock Andreas;Muller Sebastian;Duan Xiaomin;Bruns Heinz-Dietrich;Schuster Christian
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- printed circuit board;
- return current;
- via;
21.Chip oriented target impedance for digital power distribution network design

机译：面向芯片的目标阻抗，用于数字配电网络设计
- 作者：Tanaka Mikiko Sode;Toyama Masahiro;Nakashima Hidenari;Yamada Junichi;Haida Masahiro;Ooshima Izumi
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- IR-drop;
- co-design;
- target impedance;
22.A mixed-domain behavioral model's extraction for digital I/O buffers

机译：数字I / O缓冲区的混合域行为模型提取
- 作者：Dghais Wael;Cunha Telmo. R.;Pedro Jose. C.
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- behavioral models extraction;
- digital I/O buffer;
- large signal model;
- signal integrity;
23.Wafer-level TSV connectivity test using ring oscillator scheme

机译：使用环形振荡器方案的晶圆级TSV连接性测试
- 作者：Pak Jun So;Cho Jonghyun;Kim Joohee;Kim Heegon;Kim Kiyeong;Kim Joungho;Lee Junho;Park Kunwoo
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- 3DIC;
- Connectivity;
- Delamination Problem;
- Ring Oscillator;
- TSV;
- Wafer-level;
24.Thermal characterization of TSV based 3D stacked ICs

机译：基于TSV的3D堆叠IC的热特性
- 作者：Swarup Sahana;Tan Sheldon X.-D.;Liu Zao
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- COMSOL;
- Through Silicon Via (TSV);
- integrated circuits (ICs);
- thermal;
- three dimensional (3D) chip structures;
- three layer;
- two layer;
25.Millimeter-wave coplanar interconnects and radiators on FR-4 laminates

机译：FR-4层压板上的毫米波共面互连和辐射体
- 作者：Aroor Supreetha Rao;Pierce Richard;Henderson Rashaunda;Blanchard Andrew
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- CPW;
- FR-4;
- RF packaging;
- antenna-in-package;
- effective permittivity;
26.Fundamental components of the IC packaging electromagnetic interference (EMI) analysis

机译：IC封装的基本组件电磁干扰（EMI）分析
- 作者：Huang Nick K. H.;Jiang Li Jun;Yu Huichun;Li Gang;Xu Shuai;Ren Huasheng
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- EMI;
- IC packaging;
- ground lid;
- trace radiation;
- via radiation;
27.Graphene-based EMI shielding for vertical noise coupling reduction in 3D mixed-signal system

机译：基于石墨烯的EMI屏蔽可降低3D混合信号系统中的垂直噪声耦合
- 作者：Kim Kiyeong;Koo Kyoungchoul;Hong Seulki;Kim Jonghoon;Cho Byungjin;Kim Joungho
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- 3D mixed-signal system;
- Absorbance;
- Mono-layer graphene;
- Shielding Effectiveness;
- Vertical noise coupling;
28.An unconditionally stable finite-element timedomain layered domain-decomposition algorithm for simulating 3D high-speed circuits

机译：用于模拟3D高速电路的无条件稳定有限元时域分层域分解算法
- 作者：Li Xiaolei;Jin Jian-Ming
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- 3D circuits;
- domain decomposition;
- finite element method;
- time domain analysis;
29.A partial homomorphic encryption scheme for secure design automation on public clouds

机译：用于公共云上安全设计自动化的部分同态加密方案
- 作者：Yu Albert;Sathanur Arun V.;Jandhyala Vikram
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
30.Convex passivity enforcement of linear macromodels via alternate subgradient iterations

机译：通过交替次梯度迭代对线性宏模型的凸无源性实施
- 作者：Chinea A.;Grivet-Talocia S.;Calafiore G. C.
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
31.Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: Experimental validation and application to Faraday cage design

机译：3-D IC上多个硅通孔（TSV）的新型串扰建模：实验验证并应用于法拉第笼设计
- 作者：Chang Yu-Jen;Chuang Hao-Hsiang;Lu Yi-Chang;Chiou Yih-Peng;Wu Tzong-Lin;Chen Peng-Shu;Wu Shih-Hsien;Kuo Tzu-Ying;Zhan Chau-Jie;Lo Wei-Chung
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Faraday cage design;
- closed-form formulas;
- equivalent circuit model;
- through silicon via (TSV);
32.Transient analysis of high-speed channels via Newton-GMRES Waveform Relaxation

机译：通过牛顿-GMRES波形弛豫对高速通道进行瞬态分析
- 作者：Olivadese Salvatore Bernardo;Grivet-Talocia Stefano
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
33.Novel technology for power and signal integrity using a metal particle conductive layer

机译：使用金属粒子导电层的功率和信号完整性的新技术
- 作者：Sasaoka Norifumi;Ochi Takafumi;Oono Masato;Ueda Chihiro;Akiyama Yutaka;Otsuka Kanji
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- impedance;
- power integrity;
- signal integrity;
34.Interposers for power supply voltage noise reduction

机译：降低电源电压噪声的插入器
- 作者：Uematsu Yutaka;Yagyu Masayoshi;Osaka Hideki
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- electromagnetic bandgap;
- interposer;
- power delivery network;
- self impedance;
- transfer impedance;
35.Using the latency insertion method (LIM) to generate X parameters

机译：使用延迟插入方法（LIM）生成X参数
- 作者：Comberiate Thomas M.;Schutt-Aine Jose E.
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- X parameters;
- circuit simulation;
- latency insertion method (LIM);
- polyharmonic distortion (PHD);
36.An implementation of interleaved microstrip motherboard routing in Multi-Gbps I/O channel margin improvement

机译：交错微带主板路由在多Gbps I / O通道余量改善中的实现
- 作者：Tan Yih Jye;Heck Howard;Kong Jackson;Tan Wei Jern
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Far-End Crosstalk;
- channel margin improvement;
- interleaved motherboard main-route;
- multi-Gbps interfaces;
37.Fast assessment of the impact of surrounding wiring on the transmission properties of high-speed interconnect channels

机译：快速评估周围布线对高速互连通道传输特性的影响
- 作者：Chung Joon Hyung;Cangellaris Andreas C.
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
38.Mitigating TSV-induced substrate noise coupling in 3-D IC using buried interface contacts

机译：使用埋入式接口触点，减轻3D IC中TSV引起的基板噪声耦合
- 作者：Gu Xiaoxiong;Silberman Joel;Liu Yong;Duan Xiaomin
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- 3-D integrated circuit (IC);
- 3-D integration;
- substrate noise;
- through silicon via (TSV);
39.Frequency- and time-domain stochastic analysis of lossy and dispersive interconnects in a SPICE-like environment

机译：在类似SPICE的环境中有损和分散互连的频域和时域随机分析
- 作者：Manfredi Paolo;Ginste Dries Vande;De Zutter Daniel;Canavero Flavio G.
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Circuit modeling;
- circuit simulation;
- polynomial chaos;
- stochastic analysis;
- tolerance analysis;
- transmission lines;
- uncertainty;
40.Frequency domain analysis of jitter amplification in clock channels

机译：时钟通道抖动放大的频域分析
- 作者：Rao Fangyi;Hindi Sammy
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- amplification;
- jitter;
- loss;
41.Modeling and measurement of supply noise induced jitter in a 12.8Gbps single-ended memory interface

机译：在12.8Gbps单端存储器接口中建模和测量电源噪声引起的抖动
- 作者：Lan Hai;Han Minghui;Schmitt Ralf
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- jitter;
- noise;
- power integrity;
42.Simultaneous switching noise analysis of reference voltage rails for pseudo differential interfaces

机译：伪差分接口的参考电压轨同时开关噪声分析
- 作者：Park Sung Joo;Choi Jae Young;Swaminathan Madhavan
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- SSN;
- ground bounce;
- pseudo-differential interface;
- reference voltage;
- referencing plane;
- simultaneous switching noise;
43.System-level performance optimization and benchmarking for on-chip graphene interconnects

机译：片上石墨烯互连的系统级性能优化和基准测试
- 作者：Pan Chenyun;Naeemi Azad
- 会议名称：《》 | 2012年
- Graphene;
- interconnect;
- system-level optimization;
44.Framework for co-simulation of signal and power integrity in server systems

机译：服务器系统中信号和电源完整性的协同仿真框架
- 作者：Winkel Thomas-Michael;Harrer Hubert;Strach Thomas;Rimolo-Donadio Renato;Kwark Young;Duan Xiaomin;Schuster Christian
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- high-speed links;
- interconnects;
- power integrity;
- server systems;
- signal integrity;
45.Design and analysis of a high-speed channel for Coded Differential signaling

机译：编码差分信令高速信道的设计与分析
- 作者：Beyene Wendemagegnehu T.;Amirkhany Amir;Kaviani Kambiz;Abbasfar Aliazam
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
46.Measurement of SSO noise and PDN impedance of 3D SiP with 4k-IO widebus structure

机译：使用4k-IO宽总线结构测量3D SiP的SSO噪声和PDN阻抗
- 作者：Tanaka Yosuke;Takatani Hiroki;Fujita Haruya;Oizono Yoshiaki;Nabeshima Yoshitaka;Sudo Toshio;Sakai Atsushi;Uchiyama Shiro;Ikeda Hiroaki
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
47.A compact on-interposer passive equalizer for chip-to-chip high-speed data transmission

机译：紧凑的插入式无源均衡器，用于芯片间高速数据传输
- 作者：Kim Heegon;Cho Jonghyun;Kim Joohee;Kim Kiyeong;Choi Sumin;Kim Joungho;Pak Jun So
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Inter-symbol Interference (ISI);
- On-interposer passive equalizer;
- Silicon-interposer;
- Wide I/O;
- Wide-band;
48.New power delivery scheme for 3D ICs to minimize simultaneous switching noise for high speed I/Os

机译：新的3D IC供电方案可最大程度地减少高速I / O的同时开关噪声
- 作者：Zhang David C.;Swaminathan Madhavan;Huh Suzanne
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Power delivery network (PDN);
- power transmission line (PTL);
- simultaneous switching noise (SSN);
49.Validation of reduced-terminal models in fast SSN analysis

机译：快速SSN分析中的简化终端模型验证
- 作者：Jiang Xinhai;Oh Dan
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- SSN;
- SSO;
- modeling reduction;
- power integrity;
- terminal reduction;
50.Current distribution and internal impedance of interconnect

机译：互连的电流分布和内部阻抗
- 作者：Xu Hongsheng;Song Jiming;Kamgaing Telesphor
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Volume integral equations;
- internal impedance;
- quasi-static approximation;
- skin effect;
51.On analytic model of multiple vias for high-speed printed circuit board and electric band-gap structures

机译：高速印刷电路板和带隙结构的多个通孔的解析模型
- 作者：Zhang Lisha;Pan George;Guo Zhonghai
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
52.Fast analysis of the impact of interconnect routing variability on signal degradation

机译：快速分析互连路由可变性对信号衰减的影响
- 作者：Ochoa Juan S.;Cangellaris Andreas C.
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
53.Findings and considerations for I/O clock jitter on a source synchronous front side bus

机译：源同步前端总线上I / O时钟抖动的发现和注意事项
- 作者：Dreps Daniel;Daniels Len;Mandrekar Rohan;Shan Lei
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Clock Jitter;
- Front Side Bus;
- Source Synchronous;
54.Eye diagram parameter extraction of nano scale VLSI interconnects

机译：纳米级VLSI互连的眼图参数提取
- 作者：Mehri Milad;Sarvari Reza;Seydolhosseini Atefesadat
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Eye diagram;
- Eye opening;
- Jittre;
- VLSI Interconnect;
55.Frequency and time domain measurement of through-silicon via (TSV) failure

机译：贯穿硅通孔（TSV）故障的频率和时域测量
- 作者：Jung Daniel H.;Kim Joohee;Kim Heegon;Kim Jonghoon J.;Kim Joungho;Pak Jun So;Yook Jong-Min;Kim Jun Chul
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- defect localization;
- disconnection failure;
- through-silicon via (TSV);
56.Modeling broadside coupled traces using equivalent per unit length (Eq PUL) RLGC model

机译：使用等效单位长度（Eq PUL）RLGC模型对宽边耦合走线建模
- 作者：Chada Arun Reddy;Wu Songping;Fan Jun;Drewniak James L.;Mutnury Bhyrav;de Araujo Daniel N.
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Broadisde Coupled;
- per-unit-length(PUL) RLGC;
57.Chip-package co-design for suppressing parallel resonance and power supply noise

机译：芯片封装协同设计，可抑制并联谐振和电源噪声
- 作者：Mido Tatsuya;Kobayashi Ryota;Kubo Genki;Otsuka Hiroki;Kobayashi Yoshinori;Fujii Hideyuki;Sudo Toshio
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
58.Enhanced eye-height estimation of mismatched lossy transmission lines

机译：失配有损传输线的增强的眼高估计
- 作者：Huang Shih-Ya;Cheng Yung-Shou;Liu Bob;Wu Ruey-Beei
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Eye diagram;
- lossy line;
- mismatch;
- peak distortion analysis (PDA);
- pulse response;
- signal integrity;
- worst-case;
59.Bandwidth and gain enhancement of antenna in package

机译：封装天线的带宽和增益增强
- 作者：Tong Z.;Fischer A.;Stelzer A.;Maurer L.
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- antenna in package;
- cavity;
- dielectric lens;
- wide bandwidth;
60.Embedded toroidal magnetic coupling probe in multi-layer PCBs for current measurement

机译：多层PCB中的嵌入式环形磁耦合探头用于电流测量
- 作者：Kim Jonghoon J.;Kim Heegon;Kong Sunkyu;Jung Daniel H.;Kim Joungho;Kim Jiseong;Sung Hajin
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- current probing;
- inductive coupling;
- signal reconstruction;
61.A new efficient method for modeling dense via arrays with 1D discretization in 2D method of moment and group T matrix

机译：二维矩量法和群T矩阵的一维离散化致密通孔阵列的新有效方法
- 作者：Chang Xin;Tsang Leung
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Foldy-Lax equations;
- T-matrix;
- multiple scattering;
- signal integrity;
- vias;
62.Accurate and efficient computation of power plane pair inductance

机译：精确高效地计算电源平面对电感
- 作者：Li Liang;Ruehli Albert E.;Fan Jun
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
63.Coupled 2D Telegrapher's equations for PDN analysis

机译：耦合的2D电报商方程用于PDN分析
- 作者：Shlepnev Yuriy
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
64.Hybrid aggregated-vector algorithm for efficient parallelization of Fast Multipole Method

机译：快速多极点方法高效并行化的混合聚合矢量算法
- 作者：Das Arkaprovo;Gope Dipanjan
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Fast Multipole Method (FMM);
- Shared memory parallelization (SMP);
65.Loewner-Matrix based efficient algorithm for frequency sweep of high-speed modules

机译：基于Loewner-Matrix的高速模块频率扫描高效算法
- 作者：Kabir Muhammad;Khazaka Roni;Achar Ramachandra;Nakhla Michel
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
66.Improved procedure to test causality of tabulated S-parameters

机译：改进的程序来测试列表S参数的因果关系
- 作者：Lalgudi Subramanian;Asgari Saeed;Tsuk Michael
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
67.Simulation-based design of high dimensional electromagnetic systems

机译：基于仿真的高维电磁系统设计
- 作者：Cui Wei;Sathanur Arun V.;Jandhyala Vikram
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- EDA;
- Electromagnetic simulation;
- Field solver;
- Full-Wave;
- Gaussian Process;
- High Dimensional Optimization;
- Orthogonal Arrays;
- Polynomial Interpolation;
- Regression;
68.Skin effect modeling of interconnects using the Laguerre-FDTD scheme

机译：使用Laguerre-FDTD方案对互连的集肤效应建模
- 作者：Yi Ming;Swaminathan Madhavan;Qian Zhiguo;Aydiner Alaeddin
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Laguerre-FDTD;
- skin effect;
- surface impedance boundary condition (SIBC);
69.Waveform relaxation with overlapping based partitioning for fast transient simulation of package/board power distribution networks

机译：波形松弛和基于重叠的分区，可快速进行封装/电路板配电网络的瞬态仿真
- 作者：Roy Sourajeet;Dounavis Anestis
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Convergence;
- delay extraction;
- power distribution networks;
- signal integrity;
- transmission lines;
- waveform relaxation;
70.The odd couple: Antiresonance control by two capacitors of unequal series resistances

机译：奇数对：通过两个不相等串联电阻的电容器进行反谐振控制
- 作者：Yamanaga Koh;Sato Takashi
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
71.Characterizing the impact of conductor surface roughness on CB-CPW behavior via reduced computational complexity

机译：通过降低计算复杂度来表征导体表面粗糙度对CB-CPW性能的影响
- 作者：Sain Arghya;Melde Kathleen L.
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
72.Modeling and analysis of SSN in silicon and glass interposers for 3D systems

机译：用于3D系统的硅和玻璃中介层中SSN的建模和分析
- 作者：Xie Biancun;Swaminathan Madhavan
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Power delivery network;
- coupling effects;
- simultaneous switching noise;
- through-silicon via (TSV);
73.Simulation and measurement correlation of random rough surface effects in interconnects

机译：互连中随机粗糙表面效应的仿真和测量相关性
- 作者：Ding Ruihua;Braunisch Henning;Tsang Leung;Chang Wenmo
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- measurement correlation;
- perturbation method;
- random rough surface;
- three dimensional;
74.Modeling differential Through-Silicon-Vias (TSVs) with large signal, non-linear capacitance

机译：使用大信号非线性电容对差分硅通孔（TSV）建模
- 作者：Zhou Yaping;Chen Huabo;Wang Xing;Mao Wenjie;Shi Wenjun;Chang Yu
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
75.Nonlinear block-type leapfrog scheme for the fast simulation of multiconductor transmission lines with nonlinear drivers and terminations

机译：用于非线性仿真器和终端的多导体传输线快速仿真的非线性块型越级方案
- 作者：Sekine Tadatoshi;Asai Hideki
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
76.Hybrid modeling method for transient simulation of multilayered power/ground planes

机译：多层电源/地平面瞬态仿真的混合建模方法
- 作者：Watanabe Takayuki
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
77.On aperture coupling based compact system of lens enhanced phased array

机译：基于孔径耦合的透镜增强相控阵紧凑系统
- 作者：Zhang Lisha;Abbaspour-Tamijani Abbas;Pan George;Pan Helen K.
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- aperture coupling;
- directivity;
- laminates;
- lens;
- microwave;
- phased array;
78.A novel miniaturized bandstop filter using defected ground on system in package (SiP)

机译：一种新颖的小型带阻滤波器，其使用系统级封装（SiP）上的接地缺陷
- 作者：Weng Tsui-Wei;Wu Tzong-Lin
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年
- Bandstop filter (BSF);
- System in Package(SiP);
- defected ground structure (DGS);
79.Electrical design and performance of a multichip module on a silicon interposer

机译：硅中介层上多芯片模块的电气设计和性能
- 作者：Baez Franklin M.;Cranmer Mike;Shapiro Mike;Audet Jean;Berger Dan;Sprogis Ed;Collins Chris;Iyer Subramania
- 会议名称：《2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.》 | 2012年