首页> 外国专利> Methods and structures for preventing gate salicidation and for forming source and drain salicidation and for forming semiconductor device

Methods and structures for preventing gate salicidation and for forming source and drain salicidation and for forming semiconductor device

机译:防止栅极水杨酸化,形成源极和漏极水杨酸化以及形成半导体器件的方法和结构

摘要

Methods and structures for preventing salicidation are disclosed. A substrate has an gate electrode on it. Spacers are on sidewalls of the gate electrode, exposing a top portion of the gate electrode. A dielectric layer is formed above the spacers, covering the exposed top portion of the gate electrode. Methods and structures for forming source and drain salicidation are disclosed. They further salicidize source and drain regions which are adjacent to the spacers without forming salicidation on the gate electrode while salicidizing the source and drain regions. Methods and structures for forming gate electrode salicidation are also disclosed. They further form another dielectric layer covering the salicidized source and drain regions. A portion of the dielectric layer is removed so as to expose a top surface of the gate electrode. The gate electrode is then salicidized.
机译:公开了用于防止水杨酸化的方法和结构。衬底上具有栅电极。间隔物在栅电极的侧壁上,暴露出栅电极的顶部。电介质层形成在间隔物上方,覆盖栅电极的暴露的顶部。公开了用于形成源极和漏极水杨化的方法和结构。它们进一步使与间隔物相邻的源极和漏极区域水化,而在对源极和漏极区域进行水杨酸化的同时,不会在栅电极上形成水杨酸化。还公开了用于形成栅电极水杨酸化的方法和结构。它们还形成覆盖水杨酸化的源极和漏极区域的另一介电层。去除电介质层的一部分,以暴露栅电极的顶表面。然后将栅电极水化。

著录项

  • 公开/公告号US2006040481A1

    专利类型

  • 公开/公告日2006-02-23

    原文格式PDF

  • 申请/专利权人 BOR-WEN CHAN;YU-SHEN LAI;

    申请/专利号US20040919571

  • 发明设计人 BOR-WEN CHAN;YU-SHEN LAI;

    申请日2004-08-17

  • 分类号H01L21/3205;

  • 国家 US

  • 入库时间 2022-08-21 21:46:27

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