首页>
外国专利>
MODIFIED APERTURE IN EXPOSURE EQUIPMENT FOR SEMICONDUCTOR DEVICE FABRICATION
MODIFIED APERTURE IN EXPOSURE EQUIPMENT FOR SEMICONDUCTOR DEVICE FABRICATION
展开▼
机译:半导体设备制造中曝光设备的修正孔径
展开▼
页面导航
摘要
著录项
相似文献
摘要
The present invention relates to a semiconductor manufacturing technology, particularly to an illumination system of a semiconductor device will preparative exposure tool, is more related to the hit variant upper exposure equipment for producing a semiconductor device (aperture). The present invention, there is provided an aperture variation of an exposure device for manufacturing a semiconductor device which can implement the pattern pitch equal to or less than the resolution limit of an exposure light source. According to an aspect of the invention, X-axis and the first and second openings of symmetrically disposed flat arc shape of the positive direction ("()" shape), the anode of the Y-axis direction that is symmetrically disposed and a third and a fourth aperture of the arc shape of the sector ("()" shape), the first and the opening angle of 35~45 , and the second opening, the opening angle of the third and fourth openings hit the upper deformation of the semiconductor device is provided for making an exposure device, characterized in that the 5~25 .
展开▼