apparatus for separating a cull of a semiconductor package molding system

摘要

sikimeuroseo molding the semiconductor chip, an apparatus is disclosed for separating curl joined to the lead frame. And a top plate presses the curl of the lead frame are placed on the lower plate so as to curl, which is coupled to a lead frame that is separated from the lower plate and the curl lead frame lie. And, is provided so as to penetrate through the top plate, the top plate is provided on the moving path, the pilot pin and the pilot pin is pressed with the press of the curl curl, a sensor for sensing the movement of the pilot pin . Therefore, in accordance with the movement of the pilot as a sensing pins when you remove the bad cut from the mold was not made fully charged can be found immediately.