CULL SEPARATING MODULE FOR A SEMICONDUCTOR DEVICE MOLDING SYSTEM AND A CULL REMOVAL APPARATUS INCLUDING THE SAME, CAPABLE OF INCREASING THE SPEED OF A CULL SEPARATING PROCESS

摘要

PURPOSE: A cull separating module for a semiconductor device molding system and a cull removal apparatus including the same are provided to reduce a time for removing the cull of a semiconductor molding body by successively performing a separating process and a cutting process with respect to the cull.;CONSTITUTION: A first support unit(210) supports one side of a semiconductor molding body. A second support unit(220) supports the other side of the semiconductor molding body. A guide unit(230) supports the first support unit and the second support unit to be transferred. The transferring unit(240) transfers the first support unit and the second support unit along the guide unit. A driving unit controls the interval of the first support unit and the second support unit. A discharging unit(260) discharges the cull of the semiconductor molding body which is downwardly separated between the first support unit and the second support unit.;COPYRIGHT KIPO 2010