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Doped semiconductor oxide fine powders and process for their preparation

机译:掺杂的半导体氧化物细粉及其制备方法

摘要

The invention relates to areas in semiconductor technology and doped semi-conductor fine powder which, for example, can be used as coatings on television screens. The aim of the invention is to provide doped semi-conductor oxide fine powder which displays improved electrical conductivity and also improved optical transparency. The aim of the invention is achieved due to said doped semi-conductor fine powder wherein the powder grains have a production-relates segregation layer and which has an increased portion of doping elements arranged on the surface thereof and displays an even distribution of the doping elements over the total additional grain cross-section. The aim is also achieved by means of a method wherein a doped semi-conductor oxide fine powder is tempered, the powder grains having a high monomolecular layer are coated by the already used doped element(s) after cooling and then additional temperature treatment is carried out at temperatures of between 400 -1000 DEG C and at times from 10 minutes to 6 hours.
机译:本发明涉及半导体技术领域和掺杂的半导体细粉,该粉末例如可以用作电视屏幕上的涂层。本发明的目的是提供掺杂的半导体氧化物细粉,其显示出改善的电导率以及改善的光学透明性。通过所述掺杂的半导体细粉来实现本发明的目的,其中所述粉末颗粒具有与生产有关的偏析层,并且所述粉末颗粒具有布置在其表面上的掺杂元素的增加部分并且显示出掺杂元素的均匀分布。在总的额外谷物横截面上。该目的还通过以下方法来实现:对掺杂的半导体氧化物细粉进行回火,具有高单分子层的粉末颗粒在冷却后由已经使用的掺杂元素涂覆,然后进行额外的温度处理。温度在400 -1000摄氏度之间,时间从10分钟到6小时不等。

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