SOLDER BALL HOLDING INSPECTION METHOD, SOLDER BALL HOLDER FOR SEMICONDUCTOR COMPONENT USING THE SAME, AND SOLDER BALL TRANSPORTER FOR SEMICONDUCTOR COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a solder ball inspection method, a solder ball holder for a semiconductor component using the inspection method, and a solder ball transporter for the semiconductor component.;SOLUTION: The solder ball inspection method includes a step of causing a plurality of recessions 132, which are formed to electrically disconnect at least one conductive pattern 140 formed on a solder ball transport member 130, to hold a plurality of solder balls 3 to electrically connect the disconnected conductive pattern 140; a step of detecting current passage or cut-off across both ends of each of the recessions; and a step of judging on whether or not a solder ball 3 is held accurately in a recession, on the basis of a detection result on current passage or cut-off. This method allows detection/judgement without use of a camera on whether or not the solder balls 3 are held or sucked in the recessions 132 of the solder ball transport member 130.;COPYRIGHT: (C)2007,JPO&INPIT