Semiconductor component e.g. ball grid array semiconductor component, has semiconductor chip with protective casing, and soldering ball arranged in recess of electrical insulating layer and connected with connecting carrier

摘要

Component has a semiconductor chip (401) with a protective casing (406) and a contact surface (409). An electrically conducting connecting carrier (402) consists of a contact finger, which is arranged corresponding to the contact surface. Electrically conducting units (403) are arranged between the contact finger and the contact surface, and are made of polymer or resin. An electrically insulating layer with a recess is superimposed on the carrier. A soldering ball (405) is arranged in the recess and is connected with the carrier, where the layer is made of glass fiber reinforced resin. An independent claim is also included for a method for manufacturing a semiconductor component.