Semiconductor component with outer contacts (1) in the form of solder beads useful in semiconductor technology, e.g. for BGA-housings (ball-grid arrays) or as LBGA) housings (large small grid arrays)

摘要

Semiconductor component with outer contacts (1) in the form of solder beads (2) including a housing with a semiconductor chip (3) and a wiring substrate (8), with the chip on its upper side and the solder beads on its lower side, where at least one of the solder beads is fixed to a flexible membrane (3), which covers an opening (4) with a suspended membrane region (5) and the flat extent of membrane region (5) is greater than the diameter of the solder bead fixed on it. An independent claim is included for production of the component as described above.