Case e.g. ball grid array case, assembling method for interconnecting e.g. semiconductor component and external circuit, involves depositing anisotropic conductive film on surface of contact between upper and lower parts of case

摘要

The method involves depositing an anisotropic conductive film (34) on a surface of contact between upper and lower parts (2, 5) of a case e.g. ball grid array case, by cutting the conductive film such that the film covers the contact surface and applying the conductive film on the contact surface. The parts (2, 5) are assembled with each other. A physico-chemical structure of the conductive film is modified to provide electric interconnection between zones for interconnection of the parts (2, 5) and a mechanical link between the contact surface of the parts. The film seals the structure. An independent claim is also included for a case comprising an electronic component.