首页> 外国专利> Sensor component e.g. gas sensor component integrated in e.g. ball grid array package, has conductive layer that is made to contact with sensor chip by electrical contacts of conductive layer

Sensor component e.g. gas sensor component integrated in e.g. ball grid array package, has conductive layer that is made to contact with sensor chip by electrical contacts of conductive layer

机译:传感器组件集成在例如球栅阵列封装,具有导电层,该导电层通过导电层的电触点与传感器芯片接触

摘要

The sensor component (20) has sensor chip (100) arranged on base layer (300). The sensor chip is electrically connected to conductive layer. The conductive layer is made to contact with sensor chip by electrical contacts of conductive layer. A polymer material (350) is partly arranged in the component, such that an aperture is formed on the sensitive side (110) of sensor chip. An independent claim is included for method for manufacturing sensor component.
机译:传感器组件(20)具有布置在基础层(300)上的传感器芯片(100)。传感器芯片电连接到导电层。通过导电层的电接触使导电层与传感器芯片接触。聚合物材料(350)部分地布置在部件中,使得在传感器芯片的敏感侧(110)上形成孔。包括用于制造传感器部件的方法的独立权利要求。

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