Semiconductor package, substrate with conductive post, stacked type semiconductor device, manufacturing method of semiconductor package and manufacturing method of stacked type semiconductor device

摘要

A semiconductor package comprising: a substrate containing a wiring pattern connected to a plurality of external electrodes; one or more semiconductor chips connected to the wiring pattern and mounted on the substrate; a conductive post connected to a predetermined the external electrode and functioning as a relay electrode in a vertical direction; and a resin sealing layer for integrally sealing the semiconductor chips and the conductive post in a state in which an upper end face of the conductive post is exposed.