Printed circuit board, semiconductor package and multi-stack semiconductor package using the same

摘要

In an example embodiment, a printed circuit board (PCB) includes a package substrate having a plurality of first solder balls and a first resist layer formed on the first side. The first resist layer may have a plurality of first elliptical openings. Each of the first elliptical openings exposes a portion of one of the solder ball lands, respectively. In a related example embodiment, the first solder ball lands may be disposed along at least one direction of the first side and long axis of the first elliptical openings are disposed having a declination of 30° to 60° with respect to the at least one direction. In yet another example embodiment, the PCB may also have a plurality of second solder ball lands formed on a second side of the package substrate, along with a second resist layer formed on the second side of the package and including a plurality of second elliptical openings exposing a portion of one of the second solder ball lands, respectively. The PCB may also include a mounting region for a semiconductor chip located on the second side of the package substrate.