COPPER FOIL, COPPER-CLAD LAMINATE FOR SEMICONDUCTOR PACKAGE USING THE SAME, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, RESIN SUBSTRATE, FORMATION METHOD OF CIRCUIT, SEMI-ADDITIVE PROCESS, CIRCUIT FORMATION SUBSTRATE FOR SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a copper foil for a semi-additive process yielding, when laminated atop a resin substrate and then etched over the entire plane, a favorable adhesion force, with a plating film, of the etching surface of the resin substrate to which a copper foil surface profile has been transferred.;SOLUTION: The provided copper foil is a copper foil including: a copper foil bulk layer; a roughened layer formed atop the copper foil bulk layer; and a chromium-containing rustproof layer formed atop the roughened layer; the copper foil is laminated atop a resin substrate from the side of the surface possessing the roughened layer, and when the entire surface of the copper foil is etched by using an etchant, the Cr inclusion ratio (%) of a case where the respective weight concentrations (wt.%) of Cr, Zn, C, O, and Si on an occasion where the etched surface of the resin substrate following the entire surface etching is subjected to XPS surface analysis are defined respectively as A, B, C, D, and E [=A/(A+B+C+D+E)×100] is 0.1-10%.;COPYRIGHT: (C)2015,JPO&INPIT