The present invention relates to a method for reproducing the waste sludge generated during the semiconductor wafer fabrication , in greater detail relates to a reproducing method for waste sludge generated during the production of semiconductor wafers that can be played by a number of cutting material and effectively remove the cutting oil from the disposed sludge . The present invention is a 65 ~ 90 heat supply to the heating step to lower the viscosity of the disposed sludge and waste sludge ; The first centrifugation step of separating the primary centrifugal sludge heated in the heat supply to the solid phase and the liquid phase min; And provides a playback method for waste sludge generated during the production of semiconductor wafers , characterized in that comprises a second centrifugal separation step to separate the secondary centrifugal separated liquid minutes in the first centrifugation step to the cutting branch coolant .
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