BOARD FOR SEALING MICRO ELECTROMECHANICAL PART, MULTI-PATTERN BOARD FOR SEALING MICRO ELECTROMECHANICAL PART, MICRO ELECTROMECHANICAL DEVICE, AND METHOD FOR MANUFACTURING MICRO ELECTROMECHANICAL DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a board for sealing a micro electromechanical part which can prevent an application of a strain or stress to a micro electromechanical mechanism by a residual stress by a mounting heat history of electronic parts to be mounted and heat generating from their electronic parts, and can materialize a reduction in a size.;SOLUTION: In the board for sealing the micro electromechanical part, the micro electromechanical mechanism of the micro electromechanical part which has a semiconductor board, the micro electromechanical mechanism formed on a main face of the semiconductor board and a first electrode connected electrically to the micro electromechanical mechanism is airtightly sealed, and also an electronic part having a second electrode connected electrically to the first electrode is mounted thereon. A first main face of an insulating board has a first region jointed to the main face of the semiconductor board and a second region to which the electronic parts are mounted, and a wiring conductor formed within the insulating board comprises: one end led to the first region on the first main face and connected electrically to the first electrode and another end led to the second region on the first main face and connected electrically to the second electrode.;COPYRIGHT: (C)2008,JPO&INPIT