Heat sink of the holding device, method of holding the heat sink, the mounting method of the heat sink with a semiconductor device and semiconductor device

摘要

PROBLEM TO BE SOLVED: To provide a heat sink holder having a small number of parts for fixing members which prevents a heat sink from readily coming off after being mounted on a substrate, and to provide a semiconductor device having a heat sink and a method for mounting a semiconductor.;SOLUTION: An LSI (large scale integrated circuit) 5 is mounted on the substrate 6, which is then set up at a recess 25 provided at a support member 7, with the LSI5 mounting surface upside. A heat conductive compound 10 is applied to an upper surface of the LSI5 for junction with a base 3 of the heat sink 1 through the compound 10. Stepped screws 9, each fitted with a compression spring 8 at a large diameter shaft 16, are inserted into through holes 20, respectively, which are provided at a fixing portion 4 of the heat sink 1. Subsequently, the screws 9 are screwed into threaded portions 22 of holes 24 formed in the support member 7, respectively, to fasten the fixing portion 4 to the support member 7, thereby providing the semiconductor device having a heat sink.;COPYRIGHT: (C)2004,JPO&NCIPI