Attaching device for mounting and fixing a semiconductor device and a heat sink provided on the semiconductor device on a board, a mount board having the board, the semiconductor device, and the heat sink, and an attaching method of the semiconductor device and the heat sink provided on the semiconductor device on the board

摘要

An attaching device is provided for mounting and fixing a semiconductor device and a heat sink provided on the semiconductor device on a board. The attaching device includes a base part fixed to the board, a rotation member provided to the base part rotatably, the rotation member rotated and received at the base part so that the semiconductor device is fixed to the board, and a press mechanism that presses the heat sink to the semiconductor device when the rotation member is rotated.