首页> 外国专利> Method for Reducing Defects in Buried Oxide Layers of Silicon on Insulator Substrates

Method for Reducing Defects in Buried Oxide Layers of Silicon on Insulator Substrates

机译:减少绝缘体衬底上硅的氧化层中缺陷的方法

摘要

A method and a structure for reducing defects in buried oxide layers of a silicon-on-insulator substrate. The method includes: generating a beam of infrared radiation of a selected wavelength; exposing a silicon-on-insulator substrate to the beam of infrared radiation, the substrate comprising a buried silicon dioxide layer between a lower layer of silicon and an upper layer of silicon; and wherein silicon has a transmittance of at least 95% at the selected wavelength and silicon dioxide has a transmittance of less than 80% at the selected wavelength.
机译:用于减少绝缘体上硅衬底的掩埋氧化物层中的缺陷的方法和结构。该方法包括:产生选定波长的红外辐射束;将绝缘体上硅衬底暴露于红外辐射束,该衬底包括在硅的下层和硅的上层之间的二氧化硅埋层。其中硅在选定波长下的透射率至少为95%,二氧化硅在选定波长下的透射率小于80%。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号