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Buried layer, especially a buried silicon oxide layer of a silicon on insulator substrate for low power microelectronics, is produced by nucleation and growth at a microcavity layer
Buried layer, especially a buried silicon oxide layer of a silicon on insulator substrate for low power microelectronics, is produced by nucleation and growth at a microcavity layer
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机译:埋层,特别是低功率微电子在绝缘体基板上的硅的埋层氧化硅层,是通过在微腔层上形核和生长而产生的
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摘要
Buried layer production involves nucleation and growth at a microcavity layer. A buried layer is produced by: (a) forming a layer of microcavities (2), acting as volume compensation and nucleation centers, at the intended buried layer level in a substrate (1); (b) forming precipitated buried layer material nuclei from the nucleation centers; and (c) growing precipitates from the nuclei by concentration of buried layer material species supplied to the microcavity layer.
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