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Advanced Silicon-on-Insulator: Crystalline Silicon on Atomic Layer Deposited Beryllium Oxide

机译:先进的绝缘体上硅:原子层上沉积的结晶硅沉积氧化铍

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摘要

Silicon-on-insulator (SOI) technology improves the performance of devices by reducing parasitic capacitance. Devices based on SOI or silicon-on-sapphire technology are primarily used in high-performance radio frequency (RF) and radiation sensitive applications as well as for reducing the short channel effects in microelectronic devices. Despite their advantages, the high substrate cost and overheating problems associated with complexities in substrate fabrication as well as the low thermal conductivity of silicon oxide prevent broad applications of this technology. To overcome these challenges, we describe a new approach of using beryllium oxide (BeO). The use of atomic layer deposition (ALD) for producing this material results in lowering the SOI wafer production cost. Furthermore, the use of BeO exhibiting a high thermal conductivity might minimize the self-heating issues. We show that crystalline Si can be grown on ALD BeO and the resultant devices exhibit potential for use in advanced SOI technology applications.
机译:绝缘体上硅(SOI)技术通过减小寄生电容来改善器件的性能。基于SOI或蓝宝石硅技术的设备主要用于高性能射频(RF)和辐射敏感应用,以及用于减少微电子设备中的短通道效应的设备。尽管具有它们的优点,但是高的衬底成本和与衬底制造的复杂性相关的过热问题以及氧化硅的低导热率阻止了该技术的广泛应用。为了克服这些挑战,我们描述了一种使用氧化铍(BeO)的新方法。使用原子层沉积(ALD)来生产这种材料可降低SOI晶片的生产成本。此外,使用具有高导热性的BeO可以最大程度地减少自热问题。我们表明,可以在ALD BeO上生长晶体硅,并且所得器件展现出可用于高级SOI技术应用的潜力。

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