A MEMS PACKAGE USING FLEXIBLE SUBSTRATES, AND METHOD THEREOF

摘要

A MEMS package and a method for its forming are described. The MEMS package has at least one MEMS device (40) located on a flexible substrate (10). A metal structure (54, 56) surrounds the at least one MEMS device (40) wherein a bottom surface of the metal structure (54, 56) is attached to the flexible substrate (10) and wherein a portion of the flexible substrate (10) is folded over a top surface of the metal structure (54, 56) and attached to the top surface of the metal structure thereby forming the MEMS package.