CONDUCTING PARTICLE COMPLEX WITH MICROCAPSULES, PREPARATION THEREOF AND ANISOTROPIC CONDUCTIVE ADHESIVE FILM USED THEREOF

摘要

A microcapsule-conductive particle composite, its preparation method, and an anisotropic conductive adhesive film using the microcapsule-conductive particle composite are provided to control surface adsorption density, to prevent the agglomeration of particles and to improve low temperature fast curing effect. A microcapsule-conductive particle composite comprises a conductive metal particle or a conductive particle comprising a polymer particle whose surface is coated with a conductive metal layer; and a microcapsule which has a surface functional group with the affinity to the metal, and comprises a core part and a shell part, wherein the microcapsule is adsorbed on the surface of the conductive particle or the conductive particle is adsorbed on the surface of the microcapsule, and the core part of the microcapsule comprises a low temperature fast curing type organic compound curing agent.